JPS6334276Y2 - - Google Patents
Info
- Publication number
- JPS6334276Y2 JPS6334276Y2 JP1983067886U JP6788683U JPS6334276Y2 JP S6334276 Y2 JPS6334276 Y2 JP S6334276Y2 JP 1983067886 U JP1983067886 U JP 1983067886U JP 6788683 U JP6788683 U JP 6788683U JP S6334276 Y2 JPS6334276 Y2 JP S6334276Y2
- Authority
- JP
- Japan
- Prior art keywords
- cap
- seal ring
- storage container
- sealing
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Storage Of Web-Like Or Filamentary Materials (AREA)
- Solid State Image Pick-Up Elements (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1983067886U JPS59173343U (ja) | 1983-05-06 | 1983-05-06 | 半導体素子収納容器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1983067886U JPS59173343U (ja) | 1983-05-06 | 1983-05-06 | 半導体素子収納容器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59173343U JPS59173343U (ja) | 1984-11-19 |
JPS6334276Y2 true JPS6334276Y2 (en]) | 1988-09-12 |
Family
ID=30198070
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1983067886U Granted JPS59173343U (ja) | 1983-05-06 | 1983-05-06 | 半導体素子収納容器 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59173343U (en]) |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS559450A (en) * | 1978-07-05 | 1980-01-23 | Nec Corp | Container for semiconductor device |
-
1983
- 1983-05-06 JP JP1983067886U patent/JPS59173343U/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS59173343U (ja) | 1984-11-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP3621435B2 (ja) | パッケージおよびその製造方法 | |
JPS6334276Y2 (en]) | ||
JPH07113706A (ja) | 半導体圧力センサのパッケージ構造 | |
US6368898B1 (en) | Solid-state image sensing device | |
JPS6329973A (ja) | 電子写真複写装置 | |
JPS6012287Y2 (ja) | 半導体装置 | |
JPS5812478A (ja) | 固体撮像装置の製造方法 | |
JPS63208250A (ja) | 集積回路のパツケ−ジ構造 | |
JPH0348446A (ja) | 半導体装置 | |
JPH0279448A (ja) | 半導体チツプのパツケージ | |
JPS6334275Y2 (en]) | ||
JP2528687Y2 (ja) | プレナ−型2端子双方向サイリスタ | |
JPH1098122A (ja) | 半導体装置 | |
JPH01198054A (ja) | Icパツケージ | |
JPH02205053A (ja) | 半導体装置 | |
JPS60247385A (ja) | 固体撮像素子のパツケ−ジ封止方法 | |
JPH0492457A (ja) | 半導体装置 | |
JPH0810206Y2 (ja) | 対向型半導体装置のリードフレーム | |
JPS6032766Y2 (ja) | Lsiチツプ保護用キヤツプ | |
JPS62183146A (ja) | 半導体装置用セラミツクパツケ−ジ | |
JPH0337861B2 (en]) | ||
JPH07201893A (ja) | 半導体装置 | |
JPS63164345A (ja) | 半導体集積回路用パツケ−ジ | |
JPS62106653A (ja) | 半導体装置 | |
JPS62213144A (ja) | 集積回路装置 |